Noocyo badan oo substrates ah oo loo isticmaalo PCB-yada, laakiin si balaadhan ayaa loo qaybiyaa laba qaybood, kuwaas oo kala ah alaabta substrate-ka aan noolaha lahayn iyo alaabta substrate organic.
Qalabka substrate-ka aan organic
Substrate-ka aan dabiiciga ahayn inta badan waa taarikada dhoobada, alaabada wareegga dhoobada waa 96% alumina, haddii loo baahdo substrate xoog sare, 99% maaddada aluminium saafi ah ayaa loo isticmaali karaa laakiin nadiifinta sare ee alumina dhibaatooyinka, heerka wax-soo-saarku waa hooseeyaa, markaa isticmaalka qiimaha aluminium saafiga ah ayaa sarreeya.Beryllium oxide sidoo kale waa maaddada substrate dhoobada, waa oksaydh bir ah, waxay leedahay sifooyin koronto oo wanaagsan iyo kulaylka kulaylka aad u fiican, waxaa loo isticmaali karaa sida substrate loogu talagalay wareegyada cufnaanta sare.
Qaybaha wareegga dhoobada waxaa inta badan loo isticmaalaa filim dhumuc weyn iyo dhuuban wareegyo isku dhafan oo isku dhafan, wareegyada isku-dhafka ah ee-chip-yar, kuwaas oo leh faa'iidooyinka in substrates wareegyada walxaha organic aysan u dhigmi karin.Tusaale ahaan, CTE ee substrate-ka wareegga dhoobada waxay la mid noqon kartaa CTE ee guryaha LCCC, markaa isku hallaynta wadajirka ah ee alxanka ayaa la heli doonaa marka la ururinayo qalabka LCCC.Intaa waxaa dheer, substrates dhoobada waxay ku habboon yihiin habka uumiga faakuumka ee soo saarista chip sababtoo ah ma sii daayaan xaddi badan oo gaas ah oo la isku dhejiyay oo keena hoos u dhaca heerka faakuumka xitaa marka la kululeeyo.Intaa waxaa dheer, substrate-yada dhoobada waxay sidoo kale leeyihiin iska caabin heerkul sarreeya, dhammaystir wanaagsan oo dusha sare ah, xasilloonida kiimikada sare, waa substrate-ka wareegga wareegga ee la doorbidayo wareegyada isku-dhafka ah ee filimka dhumuc iyo dhuuban iyo wareegyada isku-dhafka-yar-yar ee-chip-ka badan.Si kastaba ha ahaatee, way adag tahay in la farsameeyo galay substrate weyn oo siman, oo aan la samayn karaa galay multi-piece isku dhafan qaab-dhismeedka guddiga stamp si ay u daboolaan baahida wax soo saarka si toos ah Intaa waxaa dheer, ay sabab u tahay joogto ah dielectric weyn ee alaabta dhoobada, sidaas darteed waxa sidoo kale kuma habboona substrates-xawaaraha sare ee wareegga, qiimuhuna waa mid aad u sarreeya.
Qalabka substrate-ka dabiiciga ah
Agabka dabiiciga ah waxaa laga sameeyaa walxo xoojin ah sida maro fiber galaas ah (warqad faybar ah, roodhida dhalada, iwm.), oo lagu shubay xabagta xabagta, la qalajiyey meel banaan, ka dibna lagu daboolay bireed naxaas ah, oo lagu sameeyay heerkul sare iyo cadaadis.Noocan substrate-ka ah waxaa loo yaqaannaa laminate copper-clad (CCL), oo caadi ahaan loo yaqaan panels-clad panels, waa shayga ugu muhiimsan ee soo saarista PCB-yada.
CCL noocyo badan, haddii walxaha xoojinta loo isticmaalo in la qaybiyo, waxaa loo qaybin karaa warqad ku salaysan, maro fiber galaas ah, saldhig isku dhafan (CEM) iyo birta ku salaysan afar qaybood;sida ku cad xargaha xargaha dabiiciga ah ee loo isticmaalo qaybinta, waxaana loo qaybin karaa resin phenolic (PE) epoxy resin (EP), polyimide resin (PI), polytetrafluoroethylene resin (TF) iyo polyphenylene ether resin (PPO);haddii substrate-ku uu yahay mid adag oo dabacsan si loo qaybiyo, waxaana loo qaybin karaa CCL adag iyo CCL dabacsan.
Currently si ballaaran loo isticmaalo in wax soo saarka ee PCB double-dhinac waa epoxy galaas fiber circuit substrate, kaas oo isku daraa faa'iidooyinka xoogga wanaagsan ee fiber galaas iyo Epoxy resin adag, xoog iyo ductility wanaagsan.
Substrate-ka wareegga fibre-ga dhalada ee Epoxy waxaa la sameeyaa iyadoo marka hore la dhex gelinayo xabagta epoxy maro fiber galaas ah si loo sameeyo laminate.Isla mar ahaantaana, waxaa lagu daraa kiimikooyin kale, sida dawooyinka daaweeya, kuwa xasiliya, walxaha ka hortagga ololka, xabagta, iwm. Dabadeed foil naxaas ah ayaa lagu dhejiyaa oo lagu cadaadiyaa mid ama labada dhinac ee laminate si loo sameeyo fiber epoxy-ka leh oo naxaas ah. laminate.Waxaa loo isticmaali karaa in lagu sameeyo PCB-yo kala duwan oo hal dhinac ah, laba-dhinac ah iyo kuwo badan.
Waqtiga boostada: Mar-04-2022