I. BGA baakadaysan waa habka baakadeynta oo leh shuruudaha alxanka ugu sarreeya ee wax soo saarka PCB.Faa'iidooyinka ay leedahay waa sida soo socota:
1. pin gaaban, dhererka fadhiga hoose, inductance parasitic yar yar iyo capacitance, waxqabadka koronto oo aad u fiican.
2. Is dhexgalka aad u sarreeya, biinanka badan, kala dheeraynta biinanka oo weyn, biin koplanar wanaagsan.Xadka fogaanta biinanka ee koltarka QFP waa 0.3mm.Marka la ururinayo guddiga wareegga alxanka ah, saxnaanta dhejinta ee chip-ka QFP waa mid aad u adag.Kalsoonida isku xirka korantada waxay u baahan tahay dulqaadku inuu noqdo 0.08mm.biinanka elektiroonigga ah ee QFP ee leh kala fogaansho cidhiidhi ah waa dhuuban oo jilicsan, si sahlan loo maroojin karo ama loo jebin karo, taas oo u baahan in isbarbardhigga iyo qorshaha u dhexeeya biinanka guddiga wareegga waa in la dammaanad qaado.Taas bedelkeeda, faa'iidada ugu weyn ee xirmada BGA waa in 10-electrode-ka fogaanta biinanka ay weyn tahay, kala dheereynta caadiga ah waa 1.0mm.1.27mm,1.5mm (Inch 40mil, 50mil, 60mil), dulqaadka kor u qaadista waa 0.3mm, oo leh dhowr badan oo caadi ah. - shaqaynaysamashiinka SMTiyofoornada dib u shubasal ahaan buuxin kara shuruudaha shirka BGA.
II.Iyadoo BGA-du ay leedahay faa'iidooyinka kor ku xusan, waxay sidoo kale leedahay dhibaatooyinka soo socda.Kuwa soo socda waa faa'iido darrada ku jirta BGA-ga:
1. Way adag tahay in la baaro lana ilaaliyo BGA alxanka ka dib.Soosaarayaasha PCB waa inay isticmaalaan raajada fluoroscopy ama kormeerka lakabyada raajada si loo hubiyo isku halaynta xidhiidhka alxanka ee looxa wareegga, iyo kharashyada qalabku waa sarreeyaa.
2. Kala-goysyada alxanka shakhsi ahaaneed ee guddiga wareegga waa la jabay, markaa dhammaan qaybta waa in la saaraa, BGA-da la saaray dib looma isticmaali karo.
Waqtiga boostada: Jul-20-2021