1. Qaabka kuleylka kuleylka, dhumucda iyo bedka naqshadeynta
Marka loo eego shuruudaha naqshadaynta kulaylka ee qaybaha kala-baxa kulaylka loo baahan yahay waa in si buuxda loo tixgeliyo, waa in la hubiyo in heerkulka isku dhafka ee qaybaha kulaylka-soo-saarka, heerkulka dusha PCB si loo daboolo shuruudaha naqshadeynta alaabta.
2. Naqshad qallafsanaanta dusha sare ee weelka kulaylka
Shuruudaha xakamaynta kulaylka ee qaybaha soo saarista kulaylka sare, weelka kulaylka iyo qaybaha qallafsanaanta dusha sare waa in la dammaanad qaadaa inay gaaraan 3.2µm ama xitaa 1.6µm, waxay kordhisay aagga xiriirka ee dusha birta, iyadoo si buuxda loo isticmaalo isticmaalka kuleylka sare ee kuleylka. ee sifooyinka walxaha birta ah, si loo yareeyo caabbinta kulaylka xidhiidhka.Laakiin guud ahaan, qallafsanaanta waa inaan loo baahnayn mid aad u sarreeya.
3. Buuxinta xulashada walxaha
Si loo yareeyo caabbinta kulaylka ee dusha sare ee qaybta awoodda sare ee korka sare ee dusha sare iyo weelka kulaylka, isugeynta isdhexgalka iyo qalabka kuleylka kuleylka, qalabka kuleylka kuleylka leh ee kuleylka sare leh waa in la doortaa, tusaale ahaan, kuleylka iyo kuleylka kuleylka. Qalabka sida beryllium oxide (ama aluminium trioxide) xaashida dhoobada, filimka polyimide, xaashida mica, alaabta buuxinta sida dufan silikoon ah oo kuleyl leh, caag silikoon ah oo hal qayb ka kooban, caag silikoon ah oo laba qaybood ka kooban, caag silikoon ah oo kuleyl leh.
4. Rakibaadda xidhiidhka
Rakibaadda iyada oo aan lahayn dahaar: dusha sare ee qaybta → dusha sare ee kuleylka kuleylka → PCB, dusha xiriirka laba lakab.
Rakibaadda daboolan: dusha sare ee qaybta → dusha sare ee weelka kulaylka → lakabka daboolka → PCB (ama qolof chassis), saddex lakab oo dusha sare ah.Lakabka dahaarka ee lagu rakibay heerkee, waa inuu ku salaysan yahay qaybta korka ama shuruudaha korantada dusha PCB.
Waqtiga boostada: Dec-31-2021